| EFG

description

After long exposure to sunlight or washing it a certain number of times, it won't fade and it won't start moldy. The product has an improved tensile strength

SPECIFICATIONS

Packing:	Every roll in plastic film without pallet
Delivery:	Cargo will be loaded into container in factory, then be delivered to the sea port, finally be shipped to Customer’s port by MSK, MSC, CMA, COSCO, YANGMING, APL, etc.
Payment:	LC, T/T, CAD, PAYPAL, WESTERN UNION, ETC.
Loading Quantity:	Standard export loading

It has the characteristics of uniform texture. Because of the high-quality glass melting process and molding process, it enjoys high strength. Its electrical insulation performance makes it stand out in the market.

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In the manufacturing process of EFG , every production stage is under strict control to prevent issues such as too many sluggish components or parts, high rework rate, and defective percentage. It can be supplied with different packaging methods including plastic pallet packaging, carrier tape packaging, etc

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EFG is made of materials which are carefully selected and sourced. The raw materials used do not contain any toxic or harmful substances such as mercury, lead, polybrominated biphenyl, and polybrominated diphenyl ethers. Coated with a protective layer, the product is anti-rust

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The production of EFG has a high requirement for temperature environment. To protect the electronics components from damage, this product is produced in a suitable temperature and humid-free environment. Its surface can be treated with different methods such as nickel plating, tin plating, gold plating, etc

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EFG is manufactured under a complete production system. From automatic assembly and mechanical assembly to manual assembly operated by skilled workers, professional technicians are always there to supervise and inspect. The product can be processed with different patterns by laser graving technology

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The integrated circuits of EFG guarantee its reliability and low power consumption capacity. The integrated circuits gather all electronic components on a silicon chip, making the product compact and minimized. It has the advantages of high folding strength and high bending strength

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The product meets standards in terms of quality and performance. It is widely used because of better cast property and higher mechanical performance

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NANJING EFG CO., LTD., an expert of fiberglass materials

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